WS X299 SAGE
Intel LGA 2066 CEB motherboard supports quad-GPU, DDR4 4200MHz, dual M.2 & U.2, USB 3.1 Gen 2 interface, and ASUS remote control center

Application Field

Software utilities that provide convenient, secure, and cost-effective centralized IT management for SMBs.

Product Features

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The WS X299 Sage combines GPU performance with Quad-SLI support, server-level verification, and comprehensive cooling options to provide better system construction for training neural networks and processing scalable computing loads. Dual PLX chips extend the number of PCIe channels to provide additional expansion slots, providing a wide range of connectivity options that let you configure the system with the tools you need




Workstation Features - Support for multiple GPUs


The WS X299 Sage motherboard accommodates up to four dual-slot graphics cards and supports NVIDIA® SLITM and AMD CrossFireXTM 4-way configurations to enable multi-GPU setups to take advantage of new graphics technologies, including NVIDIA® Quadro®. Equipped with performance beyond 15.23 TFLOPS*, the NVIDIA Quadro is an ideal complement to the WS X299 Sage, delivering better performance for design, modeling, medical research, and processor-intensive simulation and rendering applications.


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ASUS Remote Control Center


WS X299 Sage motherboard uses ASUS remote control center, ASUS remote control center is a centralized and integrated IT management platform

Monitor and control ASUS commercial products, including servers, workstations and digital signage. ACC provides remote BIOS update via

Mobile devices monitor multiple systems and one-click software updates and configurations to provide easier server management for all IT infrastructures.



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Arbitrary adjustment

5 optimization


Optimized overclocking and cooling system



5 re-optimization gives your workstation wisdom. One-button operation handles complex tuning tasks, dynamically optimizing key aspects of the system, and providing overclocking and cooling profiles tailored for the computer. The auto-tuning utility provides superior overclocking and cooling based on your system configuration. The fans are muted during daily operations and provide better airflow when the system is exposed to CPU or GPU intensive work. The stress test feature helps optimize and overclock for workloads with high CPU or memory requirements.


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Mouse-controlled Chinese graphical BIOS


The smoother, more responsive mouse-controlled Chinese graphical BIOS has been enhanced and is now more appealing. Whether you are a computer novice or a seasoned overclocker, EZ and Advanced Mode can help you get started. Quickly set in EZ mode, apply date and time, fan profile.


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Increase memory speed


The third-generation ASUS T-design uses an excellent tracking path to transmit signals in time series and greatly reduce crosstalk, enhance memory stability and compatibility, and support memory speeds above DDR4-4200MHz.


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OC Design – ASUS PRO Clock II overclocking technology


The WS X299 Sage features a dedicated base frequency (BCLK) generator that extends CPU and memory overclocking margins.


This custom solution works in conjunction with the TPU to enhance voltage and BCLK overclocking control, allowing you to take advantage of the performance of the Intel® CoreTM X-Series processors.




Flexible thermal control


The WS X299 Sage comes with comprehensive thermal control that can be set via Fan Xpert 4 or UEFI BIOS.




High performance VRM heat sink


Designed for powerful Intel Core X-Series processors up to 18 cores, the thermal design ensures greater performance without CPU throttling. This innovative thermal design combines high-performance VRM heat sinks with a metal fin array design for greater heat dissipation surface area, plus a heat sink and associated heat pipe for even greater thermal performance, no matter how demanding the WS X299 Sage can handle it smoothly.


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Multiple PLX radiator


With dual PLX chips, the number of available PCIe channels can be increased to support four GPU configurations, and the WS X299 Sage also provides a powerful thermal solution to eliminate the heat generated by high-speed traffic. Additional heatsink arrays and heat pipes are placed over the PLX chip and placed in a larger airflow path within the chassis to reduce the PLX temperature by approximately 20°C for better heat dissipation and system stability.



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ProCool high-intensity power interface


ASUS ProCool is a high-intensity power interface that provides a safer, lower impedance connection for better heat dissipation and increased reliability than traditional power interfaces.


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Double onboard M.2

Free storage speed up to 32Gbps


The WS X299 Sage features dual onboard M.2 slots, each running on X4 PCI Express 3.0, providing ample 32Gbps bandwidth.


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VROC

Upgrade your RAID


PCH-based RAID arrays have a bottleneck on the DMI bus's 32Gbps limit, and VROC gives you the benefit.

Use the CPU PCIe channel to configure a bootable RAID array with faster data transfer speeds, eliminating the aforementioned limitations.


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Dual U.2 interface

Enjoy NVMe innovation


Innovative specifications let your SSD run at full speed. As long as you connect the selected disk drive, you can experience data transfer speeds of up to 32Gbps, while vacating a PCIe slot for retrofitting!


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Intel Proud memory

Support for Intel AoTeng memory


Intel® OptaneTM supports Intel® AoTengTM memory technology. It is an innovative technology (non-volatile storage).

Intel Proton's memory speeds up attached storage, reducing startup and load times, making it faster and more responsive.


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USB 3.1 Gen 2 front interface

Keeping pace with the times


Front Panel of the WS X299 Sage The USB 3.1 interface supports next-generation computer chassis and devices.


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USB 3.1 Gen 2 Type-A & Type-C

Onboard speed 10Gb/s USB 3.1 Gen 2 interface


Equipped with a backward-compatible USB 3.1 Gen 2 Type-ATM interface and USB 3.1 Gen 2 Type-CTM front and back plug-in for flexible connectivity and fast 10Gb/s data transfer speeds.


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Dual Intel® Server Grade Gigabit LAN

Lower CPU usage and higher throughput


For a more reliable network, the WS X299 Sage is equipped with a server-class dual Intel® Gigabit NIC to ensure low CPU usage and temperature, higher performance, and support for more operating systems. The dual Ethernet interface also supports the grouping function that can be combined with network links to improve the transmission capacity or the backup capability when the fault occurs.


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Server level memory verification


The WS X299 Sage supports up to 128GB of four-channel DDR4 memory for easy processing of larger data sets found in professional workloads. Strict verification of various memory types and operating conditions—including time, temperature, and voltage range—the WS X299 Sage provides the reliability and stability that professionals rely on to do everything.


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SafeSlot High Strength Security Slot

Powerful protection graphics


High-strength PCIe slots are fabricated using a single injection molding process to provide greater retention and shear resistance, and a metal reinforcement layer over the slot for added ruggedness and securely attached to the PCB by additional soldering. Protect the graphics card slot and graphics card from deformation and damage.


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Intel® CoreTM X Series Processors for LGA 2066 Slots


Intel Core X Series processors (6 cores or more): 4 channels (8-DIMM), 44/28 PCI Express 3.0/2.0 channels.

Intel Core X Series processor (4 cores): 2-channel (4-DIMM), 16 PCI Express 3.0/2.0 channels.


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Intel® X299 Chipset


The Intel X299 chipset supports the LGA 2066 slot Intel Core X-Series processor. It uses serial point-to-point connections to improve performance and increase bandwidth and stability. In addition, the X299 supports 10 USB 3.1 Gen 1 interfaces, 8 SATA 6Gbps interfaces, and 32Gbps M.2 for faster data capture.


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Technical Specifications

Product Model WS X299 SAGE
CPU 支持英特爾® Socket 2066 酷睿™ X-系列 處理器
支持英特爾® Virtual RAID on CPU (VROC)
Motherboard Chipset 支持英特爾® X299
USB 英特爾® X299 芯片組 :
8 x USB 3.1 Gen 1 連接端口 (6 @後, , 2 @前)
英特爾® X299 芯片組 :
4 x USB 2.0 連接端口 (4 @後, )
ASMedia® USB 3.1 Gen 2 控制器 :
2 x USB 3.1 Gen 2 連接端口 (2 @後, , Type-A + USB Type-C)
ASMedia® USB 3.1 Gen 2 控制器 :
1 x USB 3.1 Gen 2 連接端口 (1 @前)
Graphical Display 支持 NVIDIA® 4-路 SLI™ 技術
支持 AMD 4-路 CrossFireX 技術
RAM 英特爾® 酷睿™ X-系列處理器(六核以上)
8 x DIMM, 容量可達 128GB, DDR4 4200(超頻(pín))/4133(超頻(pín))/4000(超頻(pín))/3600(超頻(pín))/2666/2400/2133 MHz Non-ECC, Un-buffered 内存
英特爾® 酷睿™ X-系列處理器(四核)
4 x DIMM, 容量可達64GB, DDR4 4200(超頻(pín))/4133(超頻(pín))/4000(超頻(pín))/3600(超頻(pín))/2666/2400/2133 MHz Non-ECC, Un-buffered内存
Internet Intel® I210-AT, 1 x 千兆網卡
Intel® I219-LM , 1 x 千兆網卡
Storage Function 英特爾® X299 芯片組 :
1 x M.2 Socket 3 插槽, 支持 M key, 2242/2260/2280/22110 類型存儲設備(PCIE 3.0 x 4模式)
1 x M.2 Socket 3 插槽, 支持 M key, 2242/2260/2280 類型存儲設備(PCIE 3.0 x 4模式)
8 x SATA 6Gb/s 接口
2 x U.2 接口*1
支持 Raid 0, 1, 5, 10
支持英特爾® 快速存儲技術企業版 5.1 (CPU RAID功能需安裝 X-系列6-核及以上處理器)
支持英特爾® 智能響應技術
支持英特爾® 快速存儲技術 15
英特爾® 傲騰™ 内存技術
Intel® Virtual RAID (VROC) support for CPU RAID
Expansion 7 x PCIe 3.0/2.0 x16 擴展卡插槽 (single x16 or dual x16/x16 or triple x16/x16/x16 or quad x16/x16/x16/x16 or seven x16/x8/x8/x8/x8/x8/x8) *2
Internal I/O 1 x USB 3.1 Gen 2 前面闆接口
1 x USB 3.1 Gen 1 接口可擴展2 組外(wài)接式 USB 3.1 Gen 1 接口
1 x AAFP 前置音頻(pín)接針
1 x Aura 可編程燈帶接針
1 x M.2 Socket 3 插槽,支持 M key, 2242/2260/2280 類型存儲設備(PCIE 3.0 x 4模式)
1 x M.2 Socket 3 插槽,支持 M key, 2242/2260/2280/22110 類型存儲設備 (PCIE 3.0 x 4模式)
2 x U.2 接口
1 x 串口連接插座(COM)
1 x Aura RGB 燈帶接針
8 x SATA 6Gb/s設備連接插座
1 x TPM 接針
1 x 中(zhōng)央處理器風扇電(diàn)源插槽
2 x 機箱風扇接口
1 x VROC_HW_Key
1 x CPU 可選風扇接口
1 x 24-pin EATX主闆電(diàn)源插槽
2 x 8-pin ATX 12V主闆電(diàn)源插槽
1 x Thunderbolt 排針
1 x 6-pin ATX 電(diàn)源口
1 x AIO_水泵接口
1 x EZ XMP 開(kāi)關
1 x 電(diàn)源開(kāi)啓開(kāi)關
1 x 重啓開(kāi)關
1 x 5-pin EXT_Fan(擴展風扇)插槽
1 x 清除CMOS按鈕
1 x 水泵專用接口 (4-pin)
1 x 系統面闆接口
1 x 熱敏接頭
1 x CPU_OV 跳線
1 x MemOK! 按鈕
1 x M.2 風扇接針
Backplane I/O 2 x LAN (RJ45) 接口
6 x USB 3.1 Gen 1 接口(藍(lán)色)
1 x USB 3.1 Gen 2 (藍(lán)綠色)Type-A,
4 x USB 2.0 接口(其中(zhōng)一(yī)個接口可切換到USB BIOS Flashback™)
1 x USB 3.1 Gen 2 (黑色)USB Type-C
1 x 光纖S/PDIF數字音頻(pín)輸出接口
1 x USB BIOS Flashback™ 按鈕
1 x 8聲道音頻(pín)接口
System Windows® 10 64-bit
Aound Effect Realtek® ALC S1220A 7.1 聲道 高清晰音頻(pín)編碼解碼器
- 支持: 音頻(pín)接口檢測(Jack-detection), 多音源獨立輸出(Multi-Streaming)技術, 前面闆麥克風音頻(pín)連接端口變換(Jack-Retasking)
- 前後耳機輸出阻抗感測
- 高品質 120 dB 立體(tǐ)聲播放(fàng) 輸出 (背部Line-out) 和 113 dB (Line-in)
- 内部耳放(fàng)提升耳機與揚聲器的音質
音頻(pín)功能:
- DTS Connect
- DTS Headphone:X
- 音頻(pín)放(fàng)大(dà)器:讓耳機和音箱還原出高質量的聲音
- 高品質日系音頻(pín)電(diàn)容: 讓您享受清晰和高保真的音效。
- depop降噪電(diàn)路:減少啓動造成的瞬間爆音
左右聲道獨立布線,二邊都能輸出相同質量的音效。
Surroundings 運行溫度: 10℃ ~ 35℃
非運行溫度: -40℃ ~ 70℃
非運行濕度: 20% ~ 90% (無凝露)
Dimensions CEB 版型結構
12 英寸 x 10.5 英寸 ( 30.5 厘米 x 26.7 厘米 )
Additional Kit 使用手冊
I/O擋闆
Addressable LED extension cable
8 x SATA 6.0Gb/s數據線
1 x 垂直 M.2 支架套件
1 x COM 數據線
1 x 3-路 SLI 橋接器
1 x 4-路 SLI 橋接器
1 x MOS 散熱套件(風扇支架和 40mm x 40mm 風扇)
1 x 随機 DVD
1 x M.2 螺絲
1 x Q-Connector
1 x SLI HB 橋接器(2路-M)
Weight 禮盒(3合1)
淨重: 5.55kg
毛重: 8.06kg

散裝(5合1)
淨重: 6.99kg
毛重: 9.37kg
Remarks *Intel® VROC 通過 RSTe 和英特爾® VROC_HW_key 支持。VROC_HW_Key 需另行購買。NVMe RAID 類型與功能依據安裝的英特爾® VROC_HW_key。

*1 U.2 接口僅支持 44-Lane CPU.
*2 請查閱手冊裏的 Appendix 方框圖,了解更多詳情。