Product Features

Comprehensive IT infrastructure management solution

The WS X299 PRO/SE is equipped with an embedded iKVM module and comes with ASUS Remote Control Center software to provide SMBs with a full range of in-band and out-of-band management functions:

The embedded ASMB9-iKVM module supports remote BIOS update, fan control, stand-alone KVM, movie recording and BSOD capture, enabling a web-based graphical interface that is compatible with mainstream browsers and easy to use, even if the operating system fails or goes offline. Provide full-time remote monitoring and diagnosis.

The ASUS Remote Control Center (ACC) is a centralized and integrated IT management platform that monitors and controls ASUS' commercial products, including servers, workstations and digital signage. ACC provides remote BIOS updates, monitoring multiple systems via mobile devices, and one-click software updates and configurations to provide easier server management for all IT infrastructures.

Flagship performance (improving memory speed)

The third-generation ASUS T-design uses an excellent tracking path to transmit signals in time series and greatly reduce crosstalk, enhance memory stability and compatibility, and support memory speeds above DDR4-4133MHz.

Overclocking Design — ASUS PRO Clock II Overclocking Technology

The WS X299 PRO/SE features a dedicated base frequency (BCLK) generator that extends CPU and memory overclocking margins.

This custom solution works in conjunction with the TPU to enhance voltage and BCLK overclocking control, allowing you to take advantage of the performance of the Intel® CoreTM X-Series processors.

Support for multiple GPUs

The WS X299 PRO/SE motherboard supports NVIDIA® SLITM and AMD CrossFireXTM 2/3-way configurations with multiple GPU settings, allowing you to master new graphics technologies and drive games with performance above 4K.

Superior thermal design (high performance VRM heat sink)

Designed for powerful Intel Core X-Series processors up to 18 cores, the WS X299 PRO/SE is equipped with cooling

Designed to ensure greater performance without CPU throttling issues. This innovative thermal design combines high performance VRM dispersion

Heat sink and metal fin array design for greater heat dissipation surface area, plus two heat sinks and associated heat pipes

It can further improve the heat dissipation performance, no matter how harsh the work, the WS X299 PRO/SE can handle it smoothly.

Dual built-in M.2 and M.2 heat sinks

Excellent heat dissipation, free performance

The WS X299 PRO/SE features dual built-in M.2 slots, each running on PCI Express 3.0 X4, providing ample 32Gbps bandwidth. Both slots are located under the X299 chipset and are covered by heat sinks, which reduces the disk drive's temperature by up to 20°C and peaks in a variety of situations.

VROC

Upgrade your RAID

Additional use of the ASUS Hyper M.2 X16 card* to release the performance of the WS X299 PRO/SE virtual RAID on the CPU (VROC) with four PCIe® 3.0 x16 M.2 disk drives for a total bandwidth of up to 128Gbps. PCH-based RAID arrays have a bottleneck on the DMI bus's 32Gbps limit, and VROC allows you to use the CPU PCIe channel to configure a bootable RAID array with faster data transfer speeds, eliminating the aforementioned limitations.

USB 3.1 Gen 2 front panel interface

Keeping pace with the times

Front Panel of the WS X299 PRO/SE The USB 3.1 interface supports next-generation computer chassis and devices.

USB 3.1 Gen 2 Type-A and Type-C

Built-in USB 3.1 for 10Gbps speed

Equipped with backward compatible USB 3.1 Gen 2 Type-ATM and USB 3.1 Gen 2 Type-CTM interface for better connection flexibility and fast data transfer speeds of up to 10Gbps.

Dual Intel® Server Grade Gigabit LAN

For a more reliable network, the WS X299 PRO/SE is equipped with a server-class dual Intel® Gigabit LAN to ensure lower CPU usage and temperature, higher performance, and support for more operating systems. The dual Ethernet interface also supports the grouping function that can be combined with network links to improve the transmission capacity or the backup capability when the fault occurs.

Intel® CoreTM X Series

Intel Core X Series processors (6 cores or more): 4 channels (8-DIMM), 44/28 PCI Express 3.0/2.0 channels.

Intel Core X Series processor (4 cores): 2-channel (4-DIMM), 16 PCI Express 3.0/2.0 channels.

Intel® X299 Chipset

The Intel X299 chipset supports the LGA 2066 slot Intel Core X-Series processor. It leverages serial point-to-point connections to improve performance and increase bandwidth and stability. In addition, the X299 supports 10 USB 3.1 Gen 1 interfaces, 8 SATA 6Gbps interfaces, and 32Gbps M.2 for faster data capture.