Product Features

Arbitrary adjustment

Optimized overclocking and cooling system

5 re-optimization gives your workstation wisdom. One-button operation can handle complex tuning tasks to be dynamic

The approach optimizes key aspects of the system, providing overclocking and cooling profiles tailored for the computer.

The auto-tuning utility provides superior overclocking and cooling based on your system configuration.

The fans are muted during daily operations and provide better airflow when the system is exposed to CPU or GPU intensive work.

The stress test feature helps optimize and overclock for workloads with high CPU or memory requirements.

CPU performance speedup

Unleash the performance of your computer with the ASUS Smart Butler 3 generation app! 

Intelligent Acceleration Processor (TPU) is our intelligent automatic

The system tunes the application to provide fine-tuning of voltage, monitoring system status, 

and adjusting overclocking parameters for better performance.

Flagship performance

Make memory faster

The third-generation ASUS T-design uses a better tracking path to transmit signals in time series and significantly reduce crosstalk

Condition, strengthen memory stability and compatibility, support DDR4-4, memory speed above 133MHz.

Overclocking Design — ASUS PRO Clock II Overclocking Technology

The WS X299 PRO features a dedicated base frequency (BCLK) generator that extends CPU and memory overclocking margins.

This custom solution works in conjunction with the TPU to boost voltage and BCLK overclocking control, allowing you to use your own

For example, take advantage of the performance of Intel® CoreTM X-Series processors.

Support for multiple GPUs

The WS X299 PRO motherboard supports NVIDIA® SLITM and AMD CrossFireXTM 2/3-way configurations.

With multiple GPU settings, you can control new graphics technologies and drive games with performance above 4K.

Superior thermal design (flexible thermal control)

The WS X299 PRO is fully equipped with thermal control and can be set via Fan Xpert 4 or UEFI BIOS.

All interfaces can be configured to monitor the thermal sensor of the three user configurations and react accordingly.

Dissipate heat according to the workload. All can be easily managed with Fan Xpert 4 or UEFI.

High performance VRM heat sink

Designed for powerful Intel Core X-Series processors up to 18 cores, the WS X299 PRO is powered by

The thermal design ensures greater performance without CPU throttling issues. This innovative thermal design combines high

Performance VRM heat sink and metal fin array design for greater heat dissipation surface area, plus two

The heat sink and the connected heat pipe further enhance the heat dissipation performance, and the WS X299 PRO can handle it smoothly no matter how harsh the work.

Fast all-round connectivity

(Double built-in M.2 and M.2 heat sinks - better heat dissipation, liberating performance)

The WS X299 PRO features dual built-in M.2 slots, each running as PCI Express 3.0 X4

Provides ample 32Gbps bandwidth. Both slots are located under the X299 chipset and are covered by heat sinks.

By reducing the temperature of the disk drive by up to 20 ° C, peak performance can be achieved in a variety of situations.

VROC

Upgrade your RAID

Additional use of ASUS Hyper M.2 X16 card* to release WS X299 PRO virtual RAID on CPU (VROC)

Performance with four PCIe® 3.0 x16 M.2 disk drives for a total bandwidth of up to 128Gbps. Based on PCH

RAID arrays have bottlenecks on the DMI bus's 32Gbps cap, and VROC lets you configure data with CPU PCIe lanes

A faster bootable RAID array that eliminates the aforementioned limitations.

USB 3.1 Gen 2 front interface

Keeping pace with the times

The front USB 3.1 interface of the WS X299 PRO supports next-generation computer chassis and devices.

USB 3.1 Gen 2 Type-A and Type-C interfaces

Built-in USB 3.1 Gen 2 for 10Gbps speed

Equipped with backward compatible USB 3.1 Gen 2 Type-ATM and USB 3.1 Gen 2 Type-CTM interface for better connection flexibility and fast data transfer speeds of up to 10Gbps.

Dual Intel® Server Grade Gigabit LAN

The WS X299 PRO is equipped with a server-class dual Intel® Gigabit LAN to provide more reliable network quality.

Guaranteed lower CPU usage and temperature for superior performance and increased support for different operating systems. Double

The network interface also supports the grouping function that can be combined with the network link to improve the transmission capacity or the backup capability when the fault occurs.

Intel® CoreTM X Series Processors for LGA 2066 Slots

Intel Core X Series processors (6 cores or more): 4 channels (8-DIMM), 44/28 PCI Express 3.0/2.0 channels.

Intel Core X Series processor (4 cores): 2-channel (4-DIMM), 16 PCI Express 3.0/2.0 channels.

Intel® X299 Chipset

The Intel X299 chipset supports the LGA 2066 slot Intel Core X-Series processor.

It uses serial point-to-point connections to improve performance and increase bandwidth and stability. In addition,

The X299 supports 10 USB 3.1 Gen 1 interfaces, 8 SATA 6Gbps interfaces, and 32Gbps M.2 for faster data capture.